San Jose Marriott and San Jose Convention Center
San Jose, California, United States
26 February - 2 March 2017
Conference AL102
Emerging Patterning Technologies 2017
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Abstract Due:
6 September 2016

Author Notification:
21 October 2016

Manuscript Due Date:
30 January 2017

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Conference Chair
Conference Co-Chair
  • Joy Y. Cheng, Taiwan Semiconductor Manufacturing Co. (Taiwan)

Program Committee
  • Alan D. Brodie, KLA-Tencor Corp. (United States)
  • Kenneth R. Carter, Univ. of Massachusetts Amherst (United States)
  • Damon M. Cole, Intel Corp. (United States)
  • Juan J. de Pablo, The Univ. of Chicago (United States)
  • Michael A. Guillorn, IBM Thomas J. Watson Research Ctr. (United States)
  • Naoya Hayashi, Dai Nippon Printing Co., Ltd. (Japan)
  • Daniel J. C. Herr, The Univ. of North Carolina at Greensboro (United States)
  • Tatsuhiko Higashiki, Toshiba Corp. (Japan)
  • James A. Liddle, National Institute of Standards and Technology (United States)
  • Shy-Jay Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
  • Chi-Chun Liu, IBM Corp. (United States)
  • Hans Loeschner, IMS Nanofabrication AG (Austria)
  • John G. Maltabes, Hewlett-Packard Labs. (United States)

Program Committee continued...
Additional Conference

Conference Chair
Christopher Bencher
Applied Materials, Inc.

Conference Co-Chair
Joy Y. Cheng
Taiwan Semiconductor Manufacturing Co. Ltd.
Call for
Our conference showcases emerging lithography and patterning techniques that provide solutions for scaling semiconductor IC nodes (i.e. 7 nm technology IC nodes and beyond), wafer level packaging, and or non-IC related technologies such as MEMS, Display, Photonics, Roll-to-Roll, Meta-materials, Micro-Fluidics, 3D printing, additive manufacturing. Contributions are also welcome which create hybrid approaches which employ a combination of lithographic aerial imaging and patterning processes such as self-aligned pitch division, tone-reversals, selective depositions, directed self-assembly, etc.

Application Areas for Emerging Patterning Technologies
  • semiconductor 7nm IC nodes and beyond
  • semiconductor wafer level packaging and fan-out
  • bioelectronics and genomics
  • photovoltaics and related energy applications
  • disk drives and patterned media
  • large area display/flat panel displays
  • roll to roll/web format device manufacturing
  • bioelectronics and LEDs
  • photonic crystals & Meta-materials
  • negative-refractive-index
  • nanopatterned sensors, waveguides, antenna
  • building blocks for defect tolerant computing
  • smart resists and self-healing materials.


Direct Write or Maskless Lithography and Patterning Technologies
  • electron or Ion charged particle beams
  • optical beams
  • STED (2-color) direct write
  • resistless e-beam or ion beam direct patterning
  • beam directed nucleation, ion beam deposition
  • metal or ceramic powder sintering
  • material ablation or material transformation reactions
  • ink-jet
  • scanning array lithography, dip-pen printing, etc.
  • interference lithography, plasmonic or nearfield/evanescent wave
  • micromirror optical lithography
  • 3D metal or ceramic sintering.
Process Based Lithography and Patterning
  • directed self-assembly
  • nanoimprint lithography
  • selective deposition
  • self-aligned or pitch division process integration techniques.
In the spirit of facilitating exchange of knowledge, we strongly encourage contributions in which information critical to understanding the topic is discussed.
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