San Jose Convention Center
San Jose, California, United States
25 February - 1 March 2018
Conference 10586
Advances in Patterning Materials and Processes XXXV
Monday - Thursday 26 February - 1 March 2018
Conference
Committee
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Conference Chair
Conference Co-Chair
Program Committee
  • Robert Allen, IBM Almaden Research Ctr. (United States)
  • Gilles R. Amblard, SAMSUNG Austin Semiconductor LLC (United States)
  • Ramakrishnan Ayothi, JSR Micro, Inc. (United States)
  • Sean D. Burns, IBM Corp. (United States)
  • Ryan Callahan, FUJIFILM Electronic Materials U.S.A., Inc. (United States)
  • Ralph R. Dammel, EMD Performance Materials Corp. (United States)
  • Danilo De Simone, IMEC (Belgium)
  • Chao Fang, KLA-Tencor Texas (United States)
  • Douglas Guerrero, Brewer Science, Inc. (United States)
  • Clifford L. Henderson, Univ. of South Florida (United States)
  • Craig D. Higgins, GLOBALFOUNDRIES Inc. (United States)

Program Committee continued...
Additional Conference
Information


Conference Chair:
Christoph K. Hohle
Fraunhofer Institute for Photonic Microsystems (Germany)




Conference Co-Chair:
Roel Gronheid
KLA-Tencor/ICOS Belgium (Belgium)
Monday 26 February Show All Abstracts
Opening Remarks and Award Announcements
Monday 26 February 2018
11:00 AM - 11:10 AM
Location: Room 220C

Sessions Chairs:

Christoph K. Hohle, Fraunhofer Institute for Photonic Microsystems (Germany)
Roel Gronheid, KLA-Tencor/ICOS Belgium (Belgium)


Presentation of the 2017 C. Grant Willson Best Paper Award and the 2017 Hiroshi Ito Memorial Award for Best Student Paper

Awards Sponsored by



Presentation of the 2017 Jeffrey Byers Memorial Best Poster Award

Award Sponsored by
Session 1:
Keynote Session
Monday 26 February 2018
11:10 AM - 12:30 PM
Location: Room 220C
Session Chairs:
Christoph K. Hohle, Fraunhofer-Institut für Photonische Mikrosysteme (Germany) ;
Roel Gronheid, KLA-Tencor/ ICOS Belgium (Belgium)
Equipment intelligence: Process control in 3D (Keynote Presentation)
Paper 10586-1
Author(s): David M. Fried, Coventor, Inc. (United States)
Show Abstract
EUV lithography materials as critical scaling enablers (Keynote Presentation)
Paper 10586-2
Author(s): Geert Vandenberghe, Danilo De Simone, IMEC (Belgium)
Show Abstract
Lunch Break 12:30 PM - 1:30 PM
Session 2:
EUV: Resist Processes: Joint session with conferences 10583 and 10586
Monday 26 February 2018
1:30 PM - 3:10 PM
Location: Room 220A
Session Chairs:
Thomas I. Wallow, ASML Brion (United States) ;
James W. Thackeray, Dow Electronic Materials (United States)
Aqueous developers for ultrathin chemically amplified EUV resists
Paper 10586-3
Author(s): Dario L. Goldfarb, Bharat Kumar, IBM Thomas J. Watson Research Ctr. (United States)
Show Abstract
EUV via hole pattern fidelity enhancement through novel resist and post-litho plasma treatment
Paper 10586-4
Author(s): Hidetami Yaegashi, Tokyo Electron Ltd. (Japan); Vadim Timoshkov, Mark Maslow, Tae Kwon Jee, Liesbeth Reijnen, ASML Netherlands B.V. (Netherlands); Peter Choi, Mu Feng, Chris Spence, ASML US, Inc. (United States); Stijn Schoofs, IMEC (Belgium); Carlos Fonseca, Tokyo Electron America, Inc. (United States); Shinya Morikita, Kiyohito Ito, Shota Yoshimura, Tokyo Electron Miyagi Ltd. (Japan); Fumiko Yamashita, Tokyo Electron Miyagi Ltd. (Belgium); Kumar Kaushik Kaushik, ASML US, Inc. (Belgium); Kyohei Koike, Tokyo Electron Ltd. (Japan)
Show Abstract
Sensitizers in EUV chemically amplified resist: mechanism of sensitivity improvement
Paper 10583-3
Author(s): Yannick Vesters, IMEC (Belgium), KU Leuven (Belgium); Jing Jiang, IMEC (Belgium); Hiroki Yamamoto, The Institute of Scientific and Industrial Research, Osaka Univ. (Japan); Danilo De Simone, IMEC (Belgium); Takahiro Kozawa, The Institute of Scientific and Industrial Research (Japan); Stefan De Gendt, Geert Vandenberghe, IMEC (Belgium)
Show Abstract
EUV resist sensitization and roughness improvement by PSCAR with in-line flood exposure system
Paper 10586-5
Author(s): Seiji Nagahara, Tokyo Electron Ltd. (Japan); Michael Carcasi, Tokyo Electron America, Inc. (United States); Gosuke Shiraishi, Yukie Minekawa, Hiroyuki Ide, Yoshihiro Kondo, Kosuke Yoshihara, Ryo Shimada, Masaru Tomono, Kazuhiro Takeshita, Teruhiko Moriya, Hayakawa Makoto, Ryo Aizawa, Yoshitaka Konishi, Tokyo Electron Kyushu Ltd. (Japan); Takahiro Shiozawa, Tokyo Electron Kyushu Ltd. (Belgium); Kathleen Nafus, Tokyo Electron America, Inc. (Japan); Serge Biesemans, Tokyo Electron Europe Ltd. (Belgium); Hideo Nakashima, Tokyo Electron Ltd. (Japan); Hisashi Nakagawa, Tomoki Nagai, Motoyuki Shima, Toru Kimura, JSR Corp. (Japan); Takehiko Naruoka, JSR Micro N.V. (Japan); Masafumi Hori, JSR Micro N.V. (Belgium); Satoshi Dei, JSR Micro N.V. (Japan); Geert Vandenberghe, IMEC (Belgium); Masayuki Miyake, JSR Micro N.V. (Belgium); Danilo De Simone, Foubert Philippe, IMEC (Belgium); Akihiro Oshima, Seiichi Tagawa, Osaka Univ. (Japan)
Show Abstract
Multi-trigger resist patterning with ASML NXE3300 EUV scanner
Paper 10583-4
Author(s): Alex P. G. Robinson, The Univ. of Birmingham (United Kingdom); Yannick Vesters, IMEC (Belgium); Alexandra McClelland, Irresistible Materials Ltd. (United Kingdom); Carmen Popescu, Guy Dawson, The Univ. of Birmingham (United Kingdom); John Roth, Nano-C, Inc. (United States); Wolfgang Theis, The Univ. of Birmingham (United Kingdom)
Show Abstract
Session 3:
EUV: Metal-based Resists: Joint session with conferences 10583 and 10586
Monday 26 February 2018
3:40 PM - 5:20 PM
Location: Room 220A
Session Chairs:
Jason K. Stowers, Inpria Corp. (United States) ;
Christopher S. Ngai, Applied Materials, Inc. (United States)
Surface characterization of tin-based inorganic EUV resists
Paper 10586-6
Author(s): Ryan T. Frederick, John T. Diulus, Oregon State Univ. (United States); Mengjun Li, Rutgers, The State Univ. of New Jersey (United States); Danielle C. Hutchison, Morgan R. Olsen, Igor Lyubinetsky, Liney Arnadottir, Oregon State Univ. (United States); Eric L. Garfunkel, Rutgers, The State Univ. of New Jersey (United States); May Nyman, Oregon State Univ. (United States); Hirohito Ogasawara, SLAC National Accelerator Lab. (United States); Gregory S. Herman, Oregon State Univ. (United States)
Show Abstract
Mechanistic investigations of inorganic-organic hybrid clusters for EUV resists
Paper 10583-5
Author(s): Eric Mattson, The Univ. of Texas at Dallas (United States)
Show Abstract
Mechanisms of photodecomposition of metal-containing EUV photoresists: isotopic labelling studies
Paper 10586-7
Author(s): Michael Murphy, Steven Grzeskowiak, Jacob Sitterly, Tracy Flynn, Greg H. Denbeaux, Robert L. Brainard, SUNY Polytechnic Institute (United States)
Show Abstract
Ti-, Zr- and Hf-based molecular hybrid materials as EUV photoresists
Paper 10583-6
Author(s): Sonia Castellanos Ortega, Lianjia Wu, Olivier Lugier, Advanced Research Ctr. for Nanolithography (Netherlands)
Show Abstract
The recent status of resist outgas testing for metal containing resists at EIDEC
Paper 10583-7
Author(s): Eishi Shiobara, Shinji Mikami, Kenji Yamada, EUVL Infrastructure Development Ctr., Inc. (Japan)
Show Abstract
Tuesday 27 February Show All Abstracts
Session 4:
Materials and Etch Integration: Joint session with conferences 10586 and 10589
Tuesday 27 February 2018
8:00 AM - 10:00 AM
Location: Room 220C
Session Chairs:
Qinghuang Lin, IBM Thomas J. Watson Research Ctr. (United States) ;
Sebastian U. Engelmann, IBM Thomas J. Watson Research Ctr. (United States)
Reconsiderations of LER characterization
Paper 10586-8
Author(s): Hidetami Yaegashi, Kyohei Koike, Tokyo Electron Ltd. (Japan)
Show Abstract
Evolution of roughness during the pattern transfer of high-chi, 10nm half-pitch, silicon-containing block copolymer structures
Paper 10589-6
Author(s): Gregory Blachut, Stephen M. Sirard, Lam Research Corp. (United States); Chris A. Mack, Fractilia, LLC (United States); Michael J. Maher, Univ. of Minnesota, Twin Cities (United States); Paulina A. Rincon-Delgadillo, Boon Teik Chan, Geert Mannaert, Geert Vandenberghe, IMEC (Belgium); Grant Willson, The Univ. of Texas at Austin (United States); Christopher J. Ellison, Univ. of Minnesota, Twin Cities (United States); Diane Hymes, Lam Research Corp. (United States)
Show Abstract
Ultimate edge-placement control using combined etch and lithography patterning optimizations
Paper 10586-9
Author(s): Brennan Peterson, Katja Viantka, Michael Kubis, ASML Netherlands B.V. (Netherlands); Rich Wise, Lam Research Corp. (United States); Koen van der Straten, Melisa Luca, Salman Mokhlespour, ASML Netherlands B.V. (Netherlands); Vito Rutigliani, Philippe Leray, Sandip Halder, Patrick Jaenen, IMEC (Belgium); Daniel Sobieski, Nader Shamma, David Hellin, Lam Research Corp. (United States)
Show Abstract
Selective dry etching of silicon containing anti-reflective coating
Paper 10589-7
Author(s): Shyam Sridhar, Andrew Nolan, Li Wang, Erdinc Karakas, Sergey Voronin, Peter Biolsi, TEL Technology Ctr., America, LLC (United States); Alok Ranjan, Tokyo Electron Miyagi Ltd. (Japan)
Show Abstract
New frontiers of atomic layer etching
Paper 10589-8
Author(s): Sonam D. Sherpa, TEL Technology Ctr., America, LLC (United States); Alok Ranjan, Tokyo Electron Miyagi Ltd. (Japan)
Show Abstract
The challenge of multi-patterning lithography for contact layer in 7nm and beyond
Paper 10586-10
Author(s): Wan-Hsiang Liang, Guanchen He, Yuan Zhou, Ming Hao Tang, Bradley Morgenfeld, David Conklin, GLOBALFOUNDRIES Inc. (United States)
Show Abstract
Session 5:
EUV: Fundamentals
Tuesday 27 February 2018
10:30 AM - 12:10 PM
Location: Room 220C
Session Chairs:
Clifford L. Henderson, Univ. of South Florida (United States) ;
Chao Fang, KLA-Tencor Texas (United States)
Unraveling the role of photons and electrons upon their interaction with photoresist during EUV exposure (Invited Paper)
Paper 10586-11
Author(s): Ivan Pollentier, IMEC (Belgium); Yannick Vesters, IMEC (Belgium), KU Leuven (Belgium); Jing Jiang, IMEC (Belgium); Atish Rathore, IMEC (Belgium), KU Leuven (Belgium); Pieter Vanelderen, IMEC (Belgium); John Petersen, IMEC (Belgium), Petersen Advanced Lithography, Inc. (United States); Danilo De Simone, Geert Vandenberghe, IMEC (Belgium)
Show Abstract
Polymer effects on PAG acid yield in EUV resists
Paper 10586-12
Author(s): Steven Grzeskowiak, Jake Kaminsky, Michael Murphy, Robert L. Brainard, Greg H. Denbeaux, SUNY CNSE/SUNYIT (United States)
Show Abstract
Characterization of metal resist for EUV lithography using infrared-free-electron laser
Paper 10586-13
Author(s): Minoru Toriumi, Takayasu Kawasaki, Takayuki Imai, Koichi Tsukiyama, Tokyo Univ. of Science (Japan); Julius Joseph S. Santillan, Toshiro Itani, EUVL Infrastructure Development Ctr., Inc. (Japan)
Show Abstract
Investigations on EUVL metal resist dissolution behavior using in situ high-speed atomic force microscopy
Paper 10586-14
Author(s): Julius Joseph S. Santillan, Toshiro Itani, EUVL Infrastructure Development Ctr., Inc. (Japan)
Show Abstract
Session 6:
EUV: Novel Processes
Tuesday 27 February 2018
1:30 PM - 3:10 PM
Location: Room 220C
Session Chairs:
Danilo De Simone, IMEC (Belgium) ;
Rick Uchida, Tokyo Ohka Kogyo America, Inc. (United States)
Novel EUV resist materials for positive-tone and negative-tone development
Paper 10586-15
Author(s): Hajime Furutani, Michihiro Shirakawa, Wataru Nihashi, Hironori Oka, Mitsuhiro Fujita, FUJIFILM Corp. (Japan); Tadashi Omatsu, FUJIFILM Holdings Corp. (Japan); Toru Tsuchihashi, Nishiki Fujimaki, Toru Fujimori, FUJIFILM Corp. (Japan)
Show Abstract
Study of novel double-solubility-switchable negative-type resist
Paper 10586-16
Author(s): Satoshi Enomoto, Toyo Gosei Co., Ltd. (Japan), Osaka Univ. (Japan); Kohei Machida, Takumi Yoshino, Toyo Gosei Co., Ltd. (Japan); Takahiro Kozawa, Osaka Univ. (Japan)
Show Abstract
Polymer brush as adhesion promoter for EUV patterning
Paper 10586-17
Author(s): Jing Guo, Anuja De Silva, Yann Mignot, Yongan Xu, Abraham Arceo de la Peña, Luciana Meli, Indira Seshadri, IBM Corp. (United States); Lovejeet Singh, Tsuyoshi Furukawa, Ramakrishnan Ayothi, JSR Micro, Inc. (United States); Nelson Felix, Dan Corliss, IBM Corp. (United States)
Show Abstract
LWR enhancement for 300mm track processing
Paper 10586-18
Author(s): Harold W. Stokes, SCREEN SPE USA, LLC (United States); Masahiko Harumoto, Masaya Asai, Yuji Tanaka, Chisayo Nakayama, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Yannick Vesters, Danilo De Simone, IMEC (Belgium)
Show Abstract
Novel Sn-based photoresist for high aspect ratio patterning
Paper 10586-19
Author(s): Mengjun Li, Viacheslav Manichev, Torgny Gustafsson, Eric L. Garfunkel, Rutgers, The State Univ. of New Jersey (United States)
Show Abstract
Session 7:
Hardmasks and Underlayer
Tuesday 27 February 2018
3:40 PM - 4:40 PM
Location: Room 220C
Session Chairs:
Douglas J. Guerrero, Brewer Science, Inc. (Belgium) ;
Ryan Callahan, FUJIFILM Electronic Materials U.S.A., Inc. (United States)
The development of an SC1 removable Si-Anti-Reflective-Coating
Paper 10586-20
Author(s): Shintaro Yamada, Iou-Sheng Ke, Charlotte Cutler, Cui Li, Paul LaBeaume, Daniel Greene, Popere Bhooshan, Chris Sullivan, JoAnne Leonard, Suzanne Coley, Sabrina Wong, Jim Cameron, Dow Electronic Materials (United States); Michael Clark, Thomas Fitzgibbons, The Dow Chemical Co. (United States)
Show Abstract
New spin on carbon materials made from hemicellulose for hardmask layer
Paper 10586-21
Author(s): Kazuyo Morita, Kimiko Yamamoto, Oji Holdings Corp. (Japan); Masahiko Harumoto, Yuji Tanaka, Chisayo Nakayama, Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
Show Abstract
High-carbon fullerene based spin-on organic hardmask
Paper 10586-22
Author(s): Alex P. G. Robinson, Guy Dawson, The Univ. of Birmingham (United Kingdom); Alexandra McClelland, Alan G. Brown, Irresistible Materials Ltd. (United Kingdom); Tom Lada, Nano-C, Inc. (United States)
Show Abstract
Poster Preview Speed Talks
Tuesday 27 February 2018
4:40 PM - 5:20 PM
Location: Room 220C

Session Chairs:

Scott W. Jessen, Texas Instruments Inc. (United States)
Robert Allen, IBM Research - Almaden (United States)
Session PS:
Posters-Tuesday
Tuesday 27 February 2018
5:30 PM - 7:30 PM
Location: Hall 2

Posters will be on display from 10:00 am to 5:00 pm, and again from 5:30 pm to 7:30 pm during the poster session. Come to view the high-quality papers that are presented in this alternative format, and interact with the poster authors who will be present during the poster session. Enjoy light refreshments while networking with your colleagues.

Full author or technical registration is required for entry to the poster session. Please wear your registration badge.
Session PS1:
Poster Session: Filtration
Tuesday 27 February 2018
5:30 PM - 7:30 PM
Location: Hall 2
Application specific ratings of filters for negative-tone developer
Paper 10586-42
Author(s): Toru Umeda, Nihon Pall Manufacturing Ltd. (Japan); Yukihisa Kawada, Kazushi Masuda, FUJIFILM Electronic Materials Co., Ltd. (Japan); Naoya Iguchi, FUJIFILM Corp. (Japan); Tetsuya Murakami, Shuichi Tsuzuki, Nihon Pall Ltd. (Japan)
Show Abstract
A novel filter with unique membrane morphology for defect reduction in leading-edge photo resists
Paper 10586-43
Author(s): Tetsu Kohyama, Aiwen Wu, Yasushi Ohyashiki, Kozue Miura, Entegris, Inc. (United States)
Show Abstract
Removal of metallic contamination from lithography solvents using functionalized membrane purifiers
Paper 10586-44
Author(s): Aiwen Wu, Entegris, Inc. (United States); Tetsu Kohyama, Entegris, Inc. (Japan); James Hamzik, Saksatha Ly, Jad Jabber, Entegris, Inc. (United States)
Show Abstract
Innovative approaches to contamination control in advanced lithography filtration via functionalized membranes
Paper 10586-45
Author(s): Hassan Ait-Haddou, Frank Onyemauwa, Eilidh Bedford, Rao Varanasi, Michael Mesawich, Pall Corp. (United States)
Show Abstract
Improved airborne molecular contaminant filter performance for photolithography
Paper 10586-46
Author(s): Gerald Weineck, Brian Hoang, Joshua Lais, Donaldson Co., Inc. (United States)
Show Abstract
Session PS2:
Poster Session: DSA
Tuesday 27 February 2018
5:30 PM - 7:30 PM
Location: Hall 2
Wet etch challenges for wide-range directed self-assembly
Paper 10586-47
Author(s): Masahiko Harumoto, Yuji Tanaka, Chisayo Nakayama, Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Kimiko Yamamoto, Kazuyo Morita, Oji Holdings Corp. (Japan)
Show Abstract
DSA process window expansion by oxygen concentration
Paper 10586-48
Author(s): Masahiko Harumoto, Yuji Tanaka, Chisayo Nakayama, Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Harold W. Stokes, SCREEN SPE Germany GmbH (Germany); Maxime Argoud, CEA-LETI (France); Isabelle Servin, CEA-LETI (France), MINATEC (France); Gaëlle Chamiot-Maitral, Guillaume Claveau, Raluca Tiron, CEA-LETI (France)
Show Abstract
Directed self-assembly (DSA) for contact applications
Paper 10586-49
Author(s): Ming-Hui Weng, Tsung-Han Ko, Chih-Jie Lee, Han-Ping Shen, Chieh-Han Wu, Ken-Hsien Hsieh, Yuan-Chien Huang, Cheng-Han Wu, Chung-Ju Lee, Ching-Yu Chang, Chin-Hsiang Lin, Taiwan Semiconductor Manufacturing Co. Ltd. (Taiwan)
Show Abstract
Ultra-fast directed self-assembly materials for sub-5nm patterning application
Paper 10586-59
Author(s): Xuemiao Li, Fudan Univ. (China); Hai Deng, macromolecular science department, Fudan University (China)
Show Abstract
Session PS3:
Poster Session: Novel Processes
Tuesday 27 February 2018
5:30 PM - 7:30 PM
Location: Hall 2
Desirable material selection on self-aligned multi-patterning
Paper 10586-50
Author(s): Kyohei Koike, Tokyo Electron Kyushu Ltd. (Japan); Kazuki Yamada, Tokyo Electron Yamanashi Ltd. (Japan); Masatoshi Yamato, Tokyo Electron Miyagi Ltd. (Japan); Hidetami Yaegashi, Tokyo Electron Ltd. (Japan); Takehiro Seshimo, Takahiro Dazai, Katsumi Ohmori, Tokyo Ohka Kogyo Co., Ltd. (Japan)
Show Abstract
Synthesis of metal nanoparticle and patterning in polymeric films induced by electron beam
Paper 10586-51
Author(s): Hiroki Yamamoto, The Institute of Scientific and Industrial Research, Osaka Univ. (Japan); Takahiro Kozawa, Seiichi Tagawa, Osaka Univ. (Japan)
Show Abstract
Mechanism study of ion implantation on photoresist shrinkage
Paper 10586-52
Author(s): Heguang Shi, Huayong Hu, Zhou Fang, Semiconductor Manufacturing International Corp. (China)
Show Abstract
Materials engineering solutions to EPE
Paper 10586-57
Author(s): Regina Freed, Uday Mitra, David Hwang, Ying Zhang, Applied Materials, Inc. (United States)
Show Abstract
Chemical trimming overcoat: an advanced composition and process for photoresist enhancement in lithography
Paper 10586-58
Author(s): Xisen Hou, Cong Liu, Kevin Rowell, Irvinder Kaur, Mingqi Li, Dow Electronic Materials (United States); Paul Baranowski, Jong Park, Cheng Bai Xu, Dow Chemical Company (United States)
Show Abstract
Session PS4:
Poster Session: Underlayer and Hardmask
Tuesday 27 February 2018
5:30 PM - 7:30 PM
Location: Hall 2
Development of new polyphenols applied to spin-on carbon hardmask with characteristics of high-heat resistance and good planarization
Paper 10586-54
Author(s): Junya Horiuchi, Tomoaki Takigawa, Takashi Sato, Masatoshi Echigo, Mitsubishi Gas Chemical Co., Inc. (Japan)
Show Abstract
Process window expansion with a novel Hemicellulose SOC
Paper 10586-55
Author(s): Masahiko Harumoto, Yuji Tanaka, Chisayo Nakayama, Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan); Kimiko Yamamoto, Kazuyo Morita, Oji Holdings Corp. (Japan)
Show Abstract
Effects of fluorine contamination on spin-on dielectric thickness in semiconductor manufacturing
Paper 10586-56
Author(s): Hyoung-Ryeun Kim, SK Hynix, Inc. (Korea, Republic of)
Show Abstract
Session PS5:
Poster Session: EUV
Tuesday 27 February 2018
5:30 PM - 7:30 PM
Investigating the effect of ionizing radiation on the acid concentration necessary for dissolution of chemically amplified EUV photoresists
Paper 10586-53
Author(s): Jake Kaminsky, Steven Grzeskowiak, Jonathan Chandonait, Greg H. Denbeaux, SUNY CNSE/SUNYIT (United States)
Show Abstract
Nanoscale inhomogeneity and photoacid generation dynamics in extreme ultraviolet resist materials
Paper 10586-60
Author(s): Ping-Jui Wu, National Taiwan Univ. (Taiwan); Yu-Fu Wang, National Taiwan Univ, (Taiwan); Wei-Chi Chen, National Taiwan Univ. (Taiwan); Chien-Wei Wang, Joy Cheng, Taiwan Semiconductor Manufacturing Company, Ltd. (Taiwan); Yuan-Chung Cheng, National Taiwan Univ. (Taiwan)
Show Abstract
Molecular organometallic resists for EUV (MORE): Reactivity as a function of metal center (Bi, Sb, Te and Sn)
Paper 10586-61
Author(s): Jacob Sitterly, Michael Murphy, SUNY Polytechnic Institute (United States); Steven Grzeskowiak, SUNY CNSE/SUNYIT (United States); Gregory Denbeaux, SUNY Polytechnic Institute (United States); Robert L. Brainard, SUNY CNSE/SUNYIT (United States)
Show Abstract
Structural effects on the patterning performance of epoxide-based negative-tone photoresists
Paper 10586-62
Author(s): Brandon Sharp, Hannah Narcross, Laren Tolbert, Clifford L. Henderson, Georgia Institute of Technology (United States)
Show Abstract
Wednesday 28 February Show All Abstracts
Session 8:
DSA Materials and Characterization: Joint session with conferences 10586 and 10584
Wednesday 28 February 2018
8:00 AM - 10:00 AM
Location: Room 220C
Session Chairs:
Ralph R. Dammel, EMD Performance Materials Corp. (United States) ;
Chi-Chun Liu, IBM Corp. (United States)
A progress report on DSA of high-chi silicon containing block co-polymers (Invited Paper)
Paper 10586-23
Author(s): C. Grant Willson, Natsuko Ito, The Univ. of Texas at Austin (United States); Gregory Blachut, The Univ. of Texas at Austin (United States), Lam Research Corp. (United States); Stephen Sirard, Lam Research Corp. (United States); Yasunobu Someya, Nissan Chemical Industries, Ltd. (Japan); Jan Doise, IMEC (Belgium); Ryuta Mizuochi, Austin Lane, The Univ. of Texas at Austin (United States); Geert Vandenberghe, Paulina A. Rincon-Delgadillo, IMEC (Belgium); XiaoMin Yang, Seagate Technology LLC (United States); Christopher Ellison, Univ. of Minnesota, Twin Cities (United States)
Show Abstract
Block copolymers for sub-10nm directed self-assembly lithography
Paper 10584-18
Author(s): Natsuko Ito, Gregory Blachut, Yusuke Asano, The Univ. of Texas at Austin (United States); Christopher J. Ellison, Univ. of Minnesota, Twin Cities (United States); Grant C. Willson, The Univ. of Texas at Austin (United States); Stephen Sirard, Lam Research Corp. (United States); XiaoMin Yang, Seagate Technology LLC (United States); Austin P. Lane, The Univ. of Texas at Austin (United States)
Show Abstract
Utilization of metal-polymer interactions for self-aligned directed self-assembly of device relevant features
Paper 10586-24
Author(s): Moshe Dolejsi, Paul F. Nealey, The Univ. of Chicago (United States)
Show Abstract
Studying the effects of chemistry and geometry on DSA hole-shrink process in three dimensions
Paper 10584-19
Author(s): Chun Zhou, The Univ. of Chicago (United States); Tsuyoshi Kurosawa, Tokyo Ohka Kogyo Co., Ltd. (Japan); Jiaxing Ren, Cody Bezik, The Univ. of Chicago (United States); Jan Doise, IMEC (Belgium); Tamar Segal-Peretz, Technion-Israel Institute of Technology (Israel); Takahiro Dazai, Tokyo Ohka Kogyo Co., Ltd. (Japan); Roel Gronheid, KLA-Tencor/ ICOS Belgium (Belgium); Paulina Rincon-Delgadillo, IMEC (Belgium); Juan de Pablo, Paul F. Nealey, The Univ. of Chicago (United States)
Show Abstract
Pillars fabrication by DSA lithography: material and process options
Paper 10586-25
Author(s): Ahmed Gharbi, Patricia Pimenta-Barros, Olivia Saouaf, Laurent Pain, CEA-LETI (France); Christophe Navarro, Célia Nicolet, Ian Cayrefourcq, Arkema S.A. (France); Michele Perego, Istituto per la Microelettronica e Microsistemi (Italy); Steven Gottlieb, Instituto de Microelectrónica de Barcelona (Spain); Esteve Amat, Ctr. Nacional de Microelectrónica (Spain); Marta Fernández-Regúlez, Instituto de Microelectrónica de Barcelona (Spain); Francesc Pérez-Murano, Ctr. Nacional de Microelectrónica (Spain); Raluca Tiron, CEA-LETI (France)
Show Abstract
Session 9:
DSA Materials and Integration: Joint session with conferences 10586 and 10584
Wednesday 28 February 2018
10:30 AM - 12:10 PM
Location: Room 220C
Session Chairs:
Daniel Sanders, IBM Research - Almaden (United States) ;
J. Alexander Liddle, National Institute of Standards and Technology (United States)
The integration of 193i and DSA for BEOL metal cuts/blocks targeting sub-20nm tip-to-tip CD
Paper 10584-20
Author(s): Chi-Chun Liu, Yann Mignot, Cheng Chi, IBM Corp. (United States); Kafai Lai, Jing Sha, IBM Thomas J. Watson Research Ctr. (United States); Jing Guo, IBM Corp. (United States); Martin Glodde, IBM Thomas J. Watson Research Ctr. (United States); Richard Farrell, TEL Technology Ctr., America, LLC (United States); Nelson Felix, IBM Corp. (United States); David Hetzer, Andrew Metz, TEL Technology Ctr., America, LLC (United States); Daniel Corliss, IBM Corp. (United States)
Show Abstract
Computational enablement for designs with sub-20nm metal tip to tip using cut shapes from grapho-epitaxy directed self-assembly
Paper 10586-26
Author(s): Balint Meliorisz, Synopsys GmbH (Germany); Kafai Lai, IBM Thomas J. Watson Research Ctr. (United States); Ulrich Welling, Hans-Jürgen Stock, Sajan Marokkey, Thomas Mülders, Synopsys GmbH (Germany); Jing Sha, IBM Thomas J. Watson Research Ctr. (United States); Chi-chun Liu, Cheng Chi, Jing Guo, IBM Corp. (United States); Clifford Osborn, Jaime Morillo, IBM Research (United States); Wolfgang Demmerle, Synopsys GmbH (Germany); Derren Dunn, IBM Thomas J. Watson Research Ctr. (United States)
Show Abstract
Defect and roughness reduction of chemo-epitaxy DSA pattern
Paper 10584-21
Author(s): Makoto Muramatsu, Takanori Nishi, Gen You, Yasuyuki Ido, Tokyo Electron Kyushu Ltd. (Japan)
Show Abstract
Evaluation of line-edge/line-width roughness of directed self-assembled PS-b-PMMA patterns using coarse-grained molecular dynamics simulation
Paper 10584-22
Author(s): Shubham D. Pinge, Cornell Univ. (United States); Durairaj Baskaran, EMD Performance Materials Corp. (United States); Yong L. Joo, Cornell Univ. (United States)
Show Abstract
Manufacturing directed self assembly flows enabled by advanced materials
Paper 10584-23
Author(s): Mary Ann J. Hockey, Brewer Science Inc (United States)
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Lunch/Exhibition Break 12:10 PM - 1:30 PM
Session 10:
DSA: Defectivity and High-chi
Wednesday 28 February 2018
1:30 PM - 3:10 PM
Location: Room 220C
Session Chairs:
Mark H. Somervell, Tokyo Electron America, Inc. (United States) ;
Sean D. Burns, IBM Corp. (United States)
Defect dynamics in directed self-assembly of block copolymers
Paper 10586-28
Author(s): Tsukasa Azuma, Yuriko Seino, Hironobu Sato, Yusuke Kasahara, Katsuyoshi Kodera, Ken Miyagi, Masayuki Shiraishi, Ryota Matsuki, Terumasa Kosaka, Toshiyuki Himi, Seiji Nagahara, EUVL Infrastructure Development Ctr., Inc. (Japan); Alvin Chandra, Ryuichi Nakatani, Teruaki Hayakawa, Tokyo Institute of Technology (Japan); Kenji Yoshimoto, Takuya Omosu, Mikihito Takenaka, Kyoto Univ. (Japan)
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Impact of annealing temperature on DSA process: toward faster assembly kinetics
Paper 10586-29
Author(s): Hyo Seon Suh, Akhil Nair, Paulina A. Rincon Delgadillo, Jan Doise, Gian Lorusso, IMEC (Belgium); Paul F. Nealey, The Univ. of Chicago (United States); Victor Monreal, Durairaj Baskaran, Yi Cao, Munirathna Padmanaban, EMD Performance Materials Corp. (United States); Jin Li, Merck Performance Materials Hong Kong Ltd. (Japan); Takeshi Kato, Takumichi Sutani, Toru Ishimoto, Masami Ikota, Shunsuke Koshihara, Hitachi High-Technologies Corp. (Japan)
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A simulation study on bridge defects in lamellae-forming diblock copolymers
Paper 10586-30
Author(s): Hironobu Sato, Yuriko Seino, Yusuke Kasahara, Katsuyoshi Kodera, Ken Miyagi, Masayuki Shiraishi, Tsukasa Azuma, EUVL Infrastructure Development Ctr., Inc. (Japan)
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Directed self-assembly of triblock copolymer for sub-10nm nanofabrication using surface active additives
Paper 10586-31
Author(s): Jiajing Li, The Univ. of Chicago (United States), IMEC (Belgium); Chun Zhou, Xuanxuan Chen, The Univ. of Chicago (United States); Paulina A. Rincon-Delgadillo, IMEC (Belgium); Paul F. Nealey, The Univ. of Chicago (United States)
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Straightforward directed self-assembly process flows enabled by advanced materials
Paper 10586-32
Author(s): Kui Xu, Brewer Science, Inc. (United States)
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Session 11:
DSA: Cylinder Forming BCP and Metrology
Wednesday 28 February 2018
3:40 PM - 5:00 PM
Location: Room 220C
Session Chairs:
Ramakrishnan Ayothi, JSR Micro, Inc. (United States) ;
Raluca Tiron, CEA-LETI (France)
Characterizing the internal structure of BCP filled contact holes with critical dimension small angle x-ray scattering
Paper 10586-33
Author(s): Daniel F. Sunday, National Institute of Standards and Technology (United States); Florian Delachat, Ahmed Gharbi, Guillaume Freychet, Raluca Tiron, CEA-LETI (France); R. Joseph Kline, National Institute of Standards and Technology (United States)
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Xylan block copolymer for wide-range directed self-assembly lithography enabling wider range of 3D patterning size
Paper 10586-34
Author(s): Kimiko Yamamoto, Kazuyo Morita, Oji Holdings Corp. (Japan); Masahiko Harumoto, Yuji Tanaka, Chisayo Nakayama, Masaya Asai, SCREEN Semiconductor Solutions Co., Ltd. (Japan)
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Automated lamellar block copolymer process characterization
Paper 10586-35
Author(s): Guilhem Bernard, Alexandre Dervilllé, Johann Foucher, POLLEN Metrology (France)
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DSA process characterization using BSE metrology
Paper 10586-36
Author(s): Remi Le Tiec, Applied Materials France (France); Shimon Levi, Applied Materials, Ltd. (Israel); Ahmed Gharbi, Maxime Argoud, Raluca Tiron, Gaëlle Chamiot-Maitral, Stephane Rey, CEA-LETI (France)
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Thursday 1 March Show All Abstracts
Session 12:
Novel Processes
Thursday 1 March 2018
8:00 AM - 9:40 AM
Location: Room 220C
Session Chairs:
Gilles R. Amblard, SAMSUNG Austin Semiconductor LLC (United States) ;
Nobuyuki N. Matsuzawa, Panasonic Corp. (Japan)
Multi-color fly-cut-SAQP for reduced process variation
Paper 10586-37
Author(s): Richard A. Farrell, Elliott Franke, Kandabara Tapily, TEL Technology Ctr., America, LLC (United States); Jodi Hotalen, TEL Technology Ctr. (United States); David O'Meara, Angelique Raley, Cory Wajda, Akitero Ko, Gert Leusink, Peter Biolsi, Anton DeVilliers, TEL Technology Ctr., America, LLC (United States); David Hetzer, TEL Technology Ctr. (United States)
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Thick photosensitive polyimide film side wall angle variability and scum improvement for IC packaging stress control
Paper 10586-38
Author(s): Sohan S. Mehta, Marco Yeung, Hirokazu Aizawa, Fahad Mirza, Thiagarajan Raman, Travis Longenbach, Walter Bennett, Robert Justin Morgan, Mark Duggan, Rio Soedibyo, Sean Reidy, GLOBALFOUNDRIES Inc. (United States)
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Resist-polymer ablation by mid-infrared-free-electron laser
Paper 10586-39
Author(s): Minoru Toriumi, Yurie Yamazaki, Takayasu Kawasaki, Takayuki Imai, Koichi Tsukiyama, Tokyo Univ. of Science (Japan)
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High-precision 3D printing as a versatile tool for integrated photonics
Paper 10586-40
Author(s): Benedikt Stender, Willi Mantei, Alexander Krupp, Valentin Ratz, Fabian Hilbert, Ruth Houbertz, Multiphoton Optics GmbH (Germany)
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Evaluation of anti-sticking layers performances for 200mm wafer scale smart NILTM process through surface and defectivity characterizations
Paper 10586-41
Author(s): Florian Delachat, CEA-LETI (France), Pleiades Technologies (France); Jean-Côme Phillipe, Vincent Larrey, Frank Fournel, Sandra Bos, Stefan Landis, Hubert Teyssèdre , CEA-LETI (France); Jonas Khan , EV Group (Austria); Laurent Pain , CEA-LETI (France); Markus Wimplinger, EV Group (Austria); Xavier Chevalier, Célia Nicolet, Christophe Navarro, Ian Cayrefourcq, Arkema S.A. (France)
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